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The Springer International Series in Engineering and Computer Science Ser.: Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® by Erdogan Madenci, Bahattin Kilic and Ibrahim Guven (2012, Trade Paperback)
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ISBN-13: 9781461349891, 978-1461349891.
- Compralo SubitoFatigue Life Prediction of Solder Joints in Electronic Packag... - 9781461349891
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Informazioni su questo prodotto
Product Identifiers
PublisherSpringer
ISBN-101461349893
ISBN-139781461349891
eBay Product ID (ePID)148824281
Product Key Features
Number of PagesXx, 185 Pages
Publication NameFatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
LanguageEnglish
SubjectIndustrial Design / Packaging, Materials Science / Metals & Alloys, Manufacturing, Electrical, Materials Science / Electronic Materials
Publication Year2012
TypeTextbook
Subject AreaTechnology & Engineering
AuthorErdogan Madenci, Bahattin Kilic, Ibrahim Guven
SeriesThe Springer International Series in Engineering and Computer Science Ser.
FormatTrade Paperback
Dimensions
Item Height0.2 in
Item Weight11.5 oz.
Item Length9.3 in
Item Width6.1 in
Additional Product Features
Intended AudienceScholarly & Professional
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